Exceptional Flexible OLED Materials Cutting with High Power UV Picosecond Laser
In recent years, OLED (organic light-emitting diode) displays have risen to prominence in the mobile device market with increasing interest in foldable devices. Unique, newly developed materials enabling foldable OLED displays present particular challenges to manufacturability, at times requiring unconventional technique.
The below Application Note describes development of a cutting process for a clear polyimide-based (clear PI) OLED stack consisting of clear PI, thin hard coat (HC), and polyethylene terephthalate (PET) with pressure sensitive adhesive coating using the IceFyre high-power picosecond UV laser. The demonstrated process resulted in an exceptional OLED stack net cutting speed of >400 mm/s with all heat affected zones (HAZ) below 10 µm and, most notably, HC laser edge chipping/roughness below 5 µm.
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